Water vapor passivation of the wall facing the plasma

摘要

Before coating the barrier layer in the via holes with hydrogen radicals, particularly useful chamber passivation process is provided from the remote plasma source (60) to a hydrogen plasma cleaning low-k dielectrics. For each wafer, the chamber is passivated (86) with (other gas it is more chemically absorbed by the plasma facing or above) water vapor passes through the remote plasma source before ignition of the hydrogen plasma. Water vapor is absorbed walls such as quartz parts alumina or remote plasma source (78, 79) formed on the protective monolayer to withstand a sufficient length to protect the walls in the generation of hydrogen plasma. Thereby, of dielectric such as alumina in particular, plasma-facing wall is protected from etching selection Figure [Figure 2]