REFLOW PROCESS EVALUATION DEVICE, REFLOW PROCESS EVALUATION PROGRAM, AND REFLOW PROCESS EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide the reflow process evaluation device capable of easily calculating a breaking occurring ratio based on average main stress.;SOLUTION: The reflow process evaluation device includes a structure analyzing and calculation part 2 for calculating the average main stress acting on a joint part receiving the main stress produced by joining a chip and a substrate by solder using a reflow system, a solder layout selection part 3, a chip stress extraction part 4, an extracted stress calculation part 5, and a peel occurring ratio calculation part 6 for calculating the breaking occurring ratio from a relational expression of the breaking occurring ratio of the joint part and the average main stress acting on the joint part and the calculated average main stress.;COPYRIGHT: (C)2009,JPO&INPIT