首页> 外国专利> MANUFACTURING METHOD OF SPUTTER TARGET, SPUTTER TARGET, SPUTTERING DEVICE, MANUFACTURING METHOD OF GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT, GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND LAMP

MANUFACTURING METHOD OF SPUTTER TARGET, SPUTTER TARGET, SPUTTERING DEVICE, MANUFACTURING METHOD OF GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT, GROUP III NITRIDE COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND LAMP

机译:溅射靶的制造方法,溅射靶,溅射装置,III族氮化物半导体发光元件的制造方法,III族氮化物半导体发光元件和灯

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a sputter target that can easily optimize doping concentration of dopant elements in crystal of a gallium nitride semiconductor formed into a film using a sputtering method.;SOLUTION: Disclosed is the manufacturing method of the sputter target including a mixing step of mixing liquid Ga and dopant elements with each other. The mixing step may be a step of dissolving the dopant elements in the liquid Ga. Further, the mixing step may be a step of particulate dopant elements in the liquid Ga and then solidifying them.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种溅射靶的制造方法,该靶可以容易地使使用溅射法成膜的氮化镓半导体的晶体中的掺杂元素的掺杂浓度最优化。目标包括将液体Ga和掺杂剂元素彼此混合的混合步骤。混合步骤可以是将掺杂剂元素溶解在液体Ga中的步骤。此外,混合步骤可以是将颗粒状掺杂剂元素溶解在液体Ga中然后固化它们的步骤。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2008311420A

    专利类型

  • 公开/公告日2008-12-25

    原文格式PDF

  • 申请/专利权人 SHOWA DENKO KK;

    申请/专利号JP20070157669

  • 申请日2007-06-14

  • 分类号H01L33/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:40:23

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