MULTI-CHIP PACKAGE REDUCING POWER-UP PEAK CURRENT

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip package in which peak current during power-up is reduced.;SOLUTION: The multi-chip package includes a plurality of memory chips. Each of memory chip includes a memory cell array storing E-fuse data, a read-out control circuit performing read-out operation indicated by E-fuse data in response to a read signal, a first internal pad receiving a first signal, a read-out controller generating the read-out signal defining a read period for read-out operation in response to first control signal and generating a second control signal following the read period, and a second internal pad receiving the second control signal from the read-out controller. The plurality of memory chips are connected in series, the read-out control circuit and the read-out controller in each of a plurality of memory chips are operated so that the E-fuse data can be sequentially read across the plurality of memory chips.;COPYRIGHT: (C)2009,JPO&INPIT