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The copper foil of the folding endurance and copper foil backing material which possesses

机译:具有耐折性的铜箔和具有铜箔背衬的材料

摘要

PROBLEM TO BE SOLVED: To provide copper foil having improved folding resistance and used for a flexible printed circuit board, and to provide its production method.;SOLUTION: The folding resistant copper foil comprises a copper foil base material having a matte side and a shinny side and a thermally stable layer at least on the matte side of the copper foil base material. The surface of the shinny side in the copper foil base material is preferably provided with a thermally stable layer as well. The thermally stable layer is preferably composed of a copper plating layer in which the decrease in tensile strength caused by heat treatment is lower than that in the copper foil base material.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供具有改善的耐折叠性的铜箔,并用于柔性印刷电路板,并提供其生产方法。解决方案:耐折叠的铜箔包括具有粗糙面和光泽的铜箔基材。至少在铜箔基材的无光泽侧上具有热稳定层。铜箔基材中的光亮面的表面也优选也具有热稳定层。热稳定层优选由镀铜层构成,在该镀铜层中,由热处理引起的拉伸强度的降低低于在铜箔基材中的降低。; COPYRIGHT:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4324503B2

    专利类型

  • 公开/公告日2009-09-02

    原文格式PDF

  • 申请/专利权人 財団法人工業技術研究院;

    申请/专利号JP20040106828

  • 发明设计人 李 鴻坤;陳 友忠;

    申请日2004-03-31

  • 分类号C25D7/06;B32B15/20;C25D5/18;

  • 国家 JP

  • 入库时间 2022-08-21 19:39:52

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