首页> 外国专利> PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL

PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL

机译:电沉积铜箔的生产方法,通过该生产方法获得的电沉积铜箔,通过使用电沉积的铜箔获得的表面处理过的铜箔以及通过铜箔或铜箔所获得的铜复合层表面处理铜箔

摘要

An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group.
机译:本发明的目的是提供一种制造方法,与已经向市场提供的低轮廓电沉积铜箔相比,该方法能够有效地制造具有更低轮廓的电沉积铜箔。机械强度。为了实现该目的,采用的制造方法是通过电解含有具有环状结构的季铵盐聚合物和氯的硫酸系铜电解液来获得电沉积铜箔的方法,其中,使用基于硫酸的铜电解液,DDAC二聚体或更高级的聚合物。对于季铵盐聚合物,优选使用数均分子量为300至10000的二烯丙基二甲基氯化铵聚合物。硫酸基铜电解液优选包含双(3-磺丙基)二硫化物或3-巯基-1-丙烷磺酸,其为具有巯基的化合物。

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