首页> 外国专利> METHOD OF POSITIONING DISK-SHAPED OBJECT, DEVICE OF POSITIONING DISK-SHAPED OBJECT USING THE METHOD, CONVEYING DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS

METHOD OF POSITIONING DISK-SHAPED OBJECT, DEVICE OF POSITIONING DISK-SHAPED OBJECT USING THE METHOD, CONVEYING DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS

机译:放置盘状物体的方法,使用该方法放置盘状物体的装置,输送装置以及半导体制造装置

摘要

PROBLEM TO BE SOLVED: To shorten time of reference position teaching at each port during equipment starting-up in a semiconductor manufacturing apparatus provided with a positioning device and a conveying robot.;SOLUTION: Two points W1 and W2, in which circumference of a disk-shaped object 47 of a wafer or the like and a locus 43 of a detection unit are intersected, are detected; and a center position A of the disk-shaped object is calculated using the two points, a specific point O on a perpendicular bisector 42 of a line segment connecting the two points, and a radius r of the disk-shaped object. This makes the conveying robot perform positioning work; and by using the result, not only modification of a conveying path and reference position teaching in case of starting-up the equipment are mostly automated. In the case where there is a notch, the circumference of the disk-shaped object is detected by two loci of the detection unit and a correct center position is detected. Furthermore, in a disk-shaped object of unknown radius having a notch, the circumference is detected by three loci of the detection unit to obtain a radius, the loci being separated with each other by distance which does not bridge the notch; and accordingly, mix production using a wafer different in diameter becomes possible.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:在具有定位装置和传送机械手的半导体制造设备中,在设备启动期间缩短每个端口的参考位置示教时间;解决方案:两个点W1和W2,其中磁盘的圆周检测晶片等的形状的物体47和检测单元的轨迹43相交;使用两个点,连接两个点的线段的垂直二等分线42上的特定点O和盘形物体的半径r来计算盘形物体的中心位置A。这使输送机器人执行定位工作;通过使用该结果,不仅可以在设备启动时自动修改传送路径和参考位置示教,而且还可以使设备自动化。在存在缺口的情况下,通过检测单元的两个轨迹来检测盘状物体的周围,并检测出正确的中心位置。此外,在半径未知的具有缺口的圆盘状的物体中,通过检测部的三个轨迹来检测周长而求出半径,该轨迹之间的距离彼此不隔开缺口。因此,可以使用直径不同的晶片进行混合生产。;版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009099998A

    专利类型

  • 公开/公告日2009-05-07

    原文格式PDF

  • 申请/专利权人 RORZE CORP;

    申请/专利号JP20080299857

  • 申请日2008-11-25

  • 分类号H01L21/68;B25J9/10;

  • 国家 JP

  • 入库时间 2022-08-21 19:39:31

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