Solder foam, nanoporous solder, foam solder bump of chip package, assembly method thereof, and system including the same

摘要

A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.