首页> 外国专利> CMOS-BASED PLANAR TYPE SILICON AVALANCHE PHOTO DIODE USING SILICON EPITAXIAL LAYER AND METHOD OF MANUFACTURING THE SAME

CMOS-BASED PLANAR TYPE SILICON AVALANCHE PHOTO DIODE USING SILICON EPITAXIAL LAYER AND METHOD OF MANUFACTURING THE SAME

机译:使用硅外延层的基于CMOS的平面型硅雪崩光电二极管及其制造方法

摘要

A complementary metal-oxide semiconductor (CMOS)-based planar type avalanche photo diode (APD) using a silicon epitaxial layer and a method of manufacturing the APD, the photo diode including: a substrate; a well layer of a first conductivity type formed in the substrate; an avalanche embedded junction formed in the well layer of the first conductivity type by low energy ion implantation; the silicon epitaxial layer formed in the avalanche embedded junction; a doping area of a second conductivity type opposite to the first conductive type, formed from a portion of a surface of the well layer of the first conductivity type in the avalanche embedded junction and forming a p-n junction; positive and negative electrodes formed on the doping area of the second conductivity type and the well layer of the first conductivity type separated from the doping area of the second conductivity type, respectively; and an oxide layer formed on an overall surface excluding a window where the positive and negative electrodes are formed.
机译:使用硅外延层的基于互补金属氧化物半导体(CMOS)的平面型雪崩光电二极管(APD)及其制造方法,该光电二极管包括:基板;形成在衬底中的第一导电类型的阱层;通过低能离子注入在第一导电类型的阱层中形成雪崩嵌入结;在雪崩嵌入结中形成的硅外延层;与第一导电类型相反的第二导电类型的掺杂区域,由雪崩嵌入结中的第一导电类型的阱层的表面的一部分形成,并形成p-n结;在第二导电类型的掺杂区和第一导电类型的阱层上分别形成的正电极和负电极与第二导电类型的掺杂区分开。氧化物层形成在除形成有正极和负极的窗口以外的整个表面上。

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