首页> 外国专利> TRANSPARENT CONDUCTIVE FILM ON P-TYPE LAYER FOR GAN-BASED LED AND METHOD FOR FABRICATING THE SAME

TRANSPARENT CONDUCTIVE FILM ON P-TYPE LAYER FOR GAN-BASED LED AND METHOD FOR FABRICATING THE SAME

机译:用于基于gan的LED的p型层上的透明导电膜及其制造方法

摘要

The present disclosure provides a transparent conductive film on P-type layer of GaN-based LED and a fabricating method thereof. The transparent conductive film is fabricated by Ni/ITO, Al/ITO or NiO/ITO. In one embodiment, the thickness of the Ni layer is 5 Å to 30 Å. The thickness of the Al layer is 5 Å to 30 Å. The thickness of the NiO layer is 5 Å to 40 Å. The thickness of the ITO layer is 1000 Å to 3000 Å. In one embodiment, the fabricating method comprises steps of evaporating one of Ni, Al and NiO layers on a P-type GaN layer, heat-treating a wafer on which the Ni or Al layer is evaporated, then evaporating an ITO layer on the surface of Ni, Al or NiO layer, and heat-treating the wafer on which Ni/ITO, Al/ITO or NiO/ITO layers are evaporated. The transparent conductive film can have high light transmittance within the range of visible light and low specific contact resistance.
机译:本公开提供了基于GaN的LED的P型层上的透明导电膜及其制造方法。透明导电膜由Ni / ITO,Al / ITO或NiO / ITO制成。在一实施例中,Ni层的厚度为5埃至30埃。铝层的厚度为5到30。 NiO层的厚度为5到40。 ITO层的厚度为1000到3000。在一个实施例中,该制造方法包括以下步骤:蒸发P型GaN层上的Ni,Al和NiO层之一,对在其上蒸发了Ni或Al层的晶片进行热处理,然后蒸发表面上的ITO层。对Ni,Al或NiO层进行热处理,然后对其上蒸镀了Ni / ITO,Al / ITO或NiO / ITO层的晶片进行热处理。透明导电膜可以在可见光范围内具有高的透光率并且具有低的比接触电阻。

著录项

  • 公开/公告号US2009065795A1

    专利类型

  • 公开/公告日2009-03-12

    原文格式PDF

  • 申请/专利权人 PHILIP CHAN;RAYMOND WANG;LEO LEI;

    申请/专利号US20080184179

  • 发明设计人 LEO LEI;PHILIP CHAN;RAYMOND WANG;

    申请日2008-07-31

  • 分类号H01L33/00;H01L21/00;

  • 国家 US

  • 入库时间 2022-08-21 19:36:04

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