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IN-SITU HYBRID DEPOSITION OF HIGH DIELECTRIC CONSTANT FILMS USING ATOMIC LAYER DEPOSITION AND CHEMICAL VAPOR DEPOSITION
IN-SITU HYBRID DEPOSITION OF HIGH DIELECTRIC CONSTANT FILMS USING ATOMIC LAYER DEPOSITION AND CHEMICAL VAPOR DEPOSITION
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机译:利用原子层沉积和化学气相沉积原位混合沉积高介电常数薄膜
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摘要
An in-situ hybrid film deposition method for forming a high-k dielectric film on a plurality of substrates in a batch processing system. The method includes loading the plurality of substrates into a process chamber of the batch processing system, depositing by atomic layer deposition (ALD) a first portion of a high-k dielectric film on the plurality of substrates, after depositing the first portion, and without removing the plurality of substrates from the process chamber, depositing by chemical vapor deposition (CVD) a second portion of the high-k dielectric film on the first portion, and removing the plurality of substrates from the process chamber. The method can further include alternatingly repeating the deposition of the first and second portions until the high-k dielectric film has a desired thickness. The method can still further include pre-treating the substrates and post-treating the high-k dielectric film in-situ prior to the removing.
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