首页> 外国专利> SUSCEPTOR FOR EPITAXIAL LAYER FORMING APPARATUS, EPITAXIAL LAYER FORMING APPARATUS, EPITAXIAL WAFER, AND METHOD OF MANUFACTURING EPITAXIAL WAFER

SUSCEPTOR FOR EPITAXIAL LAYER FORMING APPARATUS, EPITAXIAL LAYER FORMING APPARATUS, EPITAXIAL WAFER, AND METHOD OF MANUFACTURING EPITAXIAL WAFER

机译:表皮层形成装置的基座,表皮层形成装置,表层晶片和表层晶片的制造方法

摘要

A susceptor for epitaxial layer forming apparatus provided in a layer forming chamber of an epitaxial layer forming apparatus includes: a recessed portion which is provided to accommodate a semiconductor wafer therein and has an approximately circular shape in plan view; and a protruding portion which is provided in the recessed portion in order to support the semiconductor wafer and has an approximately circular shape in plan view. The diameter of the protruding portion is smaller than that of the recessed portion, and the diameter of the protruding portion is set to be a size allowing reaction gas supplied for vapor-phase growth reaction to circulate through an entire boundary between the protruding portion and the semiconductor wafer when the semiconductor wafer is placed in the recessed portion.
机译:设置在外延层形成装置的层形成室中的用于外延层形成装置的基座包括:凹部,其设置为在其中容纳半导体晶片,并且在平面图中具有大致圆形的形状;凸部设置在凹部中以支撑半导体晶片,并且在平面图中具有大致圆形的形状。突出部分的直径小于凹入部分的直径,并且突出部分的直径被设定为允许供应用于气相生长反应的反应气体在突出部分和反应容器之间的整个边界处循环的尺寸。当半导体晶片被放置在凹进部分中时,该半导体晶片被去除。

著录项

  • 公开/公告号US2009127672A1

    专利类型

  • 公开/公告日2009-05-21

    原文格式PDF

  • 申请/专利权人 HIDEAKI KINBARA;

    申请/专利号US20080261511

  • 发明设计人 HIDEAKI KINBARA;

    申请日2008-10-30

  • 分类号H01L29/06;C23C16/54;H01L21/20;

  • 国家 US

  • 入库时间 2022-08-21 19:34:35

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