首页> 外国专利> PHEMT structure having recessed ohmic contact and method for fabricating same

PHEMT structure having recessed ohmic contact and method for fabricating same

机译:具有凹陷欧姆接触的PHEMT结构及其制造方法

摘要

According to an exemplary embodiment, a PHEMT (pseudomorphic high electron mobility transistor) structure includes a conductive channel layer. The PHEMT structure further includes at least one doped layer situated over the conductive channel layer. The at least one doped layer can include a heavily doped layer situated over a lightly doped layer. The PHEMT structure further includes a recessed ohmic contact situated on the conductive channel layer, where the recessed ohmic contact is situated in a source/drain region of the PHEMT structure, and where the recessed ohmic contact extends below the at least one doped layer. According to this exemplary embodiment, the recessed ohmic contact is bonded to the conductive channel layer. The recessed ohmic contact is situated adjacent to the at least one doped layer. The PHEMT structure further includes a spacer layer situated between the at least one doped layer and the conductive channel layer.
机译:根据示例性实施例,PHEMT(伪晶高电子迁移率晶体管)结构包括导电沟道层。 PHEMT结构还包括位于导电沟道层上方的至少一个掺杂层。至少一个掺杂层可以包括位于轻掺杂层上方的重掺杂层。 PHEMT结构还包括位于导电沟道层上的凹陷欧姆接触,其中该凹陷欧姆接触位于PHEMT结构的源极/漏极区域中,并且其中该凹陷欧姆接触在至少一个掺杂层下方延伸。根据该示例性实施例,凹陷的欧姆接触键合至导电沟道层。凹陷的欧姆接触与至少一个掺杂层相邻。 PHEMT结构还包括位于至少一个掺杂层和导电沟道层之间的隔离层。

著录项

  • 公开/公告号US7550785B1

    专利类型

  • 公开/公告日2009-06-23

    原文格式PDF

  • 申请/专利权人 JEROD F. MASON;DYLAN C. BARTLE;

    申请/专利号US20050293348

  • 发明设计人 DYLAN C. BARTLE;JEROD F. MASON;

    申请日2005-12-02

  • 分类号H01L29/08;

  • 国家 US

  • 入库时间 2022-08-21 19:32:11

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