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Thin film transistor, method of manufacturing same, display device, method of modifying an oxide film, method of forming an oxide film, semiconductor device, method of manufacturing semiconductor device, and apparatus for manufacturing semiconductor device

机译:薄膜晶体管,其制造方法,显示装置,氧化膜的改性方法,氧化膜的形成方法,半导体装置,半导体装置的制造方法以及半导体装置的制造装置

摘要

In a manufacturing method of a thin film transistor (1), the oxide film forming step is performed whereby: a process-target substrate (2) having a surface on which a gate oxide film (4) should be formed is immersed in an oxidizing solution containing a; active oxidizing species; and a gate oxide film (4) is formed through direct oxidation of polycrystalline silicon (51) on the process-target substrate (2). With this step, a silicon dioxide film (42) is formed while growing a silicon dioxide film (41) on the process-target substrate 2. Accordingly, the interface between the polycrystalline silicon (51) and the gate oxide film (4) is kept clean. The gate oxide film (4) is uniformly formed with excellent quality in insulation tolerance and other properties. Therefore, the thin film transistor (1) contains a high quality oxide film with excellent insulation tolerance and other properties which can be formed at low temperature.
机译:在薄膜晶体管( 1 )的制造方法中,执行氧化膜形成步骤,由此:具有在其上的表面的表面的被处理衬底( 2 )。将应形成的栅氧化膜( 4 )浸入含有α的氧化溶液中;活性氧化物质;然后通过在处理目标基板( 2 )上直接氧化多晶硅( 51 )形成栅极氧化膜( 4 )。通过该步骤,在被处理基板 2 上生长二氧化硅膜( 41 )的同时形成二氧化硅膜( 42 )。 。因此,多晶硅( 51 )和栅氧化膜( 4 )之间的界面保持清洁。栅氧化膜( 4 )形成均匀,绝缘耐受性和其他性能优异。因此,薄膜晶体管( 1 )包含具有优异的绝缘耐受性和其他特性的高质量氧化膜,该氧化物膜可以在低温下形成。

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