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Integrated circuit packages including damming and change protection cover for harsh environments

机译:集成电路封装,包括用于恶劣环境的筑坝和更换保护罩

摘要

An electronic assembly for use in a downhole tool includes a damming boot deployed about at least one integrated circuit component on a circuit board. The boot is disposed to house the integrated circuit leads and solder joints in a substantially sealed cavity between the circuit board, the integrated circuit body, and an inner surface of the damming boot. The boot is also disposed to support the integrated circuit body and thereby improve the shock and vibration resistance of various electronic assemblies used in downhole tools. The invention also tends to improve the reworkability of downhole electronic assemblies.
机译:一种用于井下工具中的电子组件,其包括围绕电路板上的至少一个集成电路组件展开的阻尼罩。所述保护罩被布置为在电路板,集成电路主体和隔震保护罩的内表面之间的基本上密封的空腔中容纳集成电路引线和焊点。保护罩还被布置为支撑集成电路主体,从而改善了在井下工具中使用的各种电子组件的抗冲击和振动性。本发明还倾向于改善井下电子组件的可再加工性。

著录项

  • 公开/公告号US7615712B2

    专利类型

  • 公开/公告日2009-11-10

    原文格式PDF

  • 申请/专利权人 HUGH PATTON HANLEY;

    申请/专利号US20060590229

  • 发明设计人 HUGH PATTON HANLEY;

    申请日2006-10-31

  • 分类号H01L23/28;

  • 国家 US

  • 入库时间 2022-08-21 19:30:31

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