Apparatus and method for making integrated circuit packages having integrated circuits mounted onto passive electrical components

摘要

Semiconductor package assemblies having integrated circuits mounted onto passive electrical components. The assemblies each include an inductor having a magnetic core and an wire wrapped around the magnetic core. An integrated circuit die is positioned either on or within a recess formed in the magnetic core of the inductor. Electrical traces are formed on the magnetic core. The electrical traces are configured to electrically couple the inductive wire of the inductor with the integrated circuit die positioned on or recessed within the inductor.