首页> 外国专利> A NOVEL PROCESS FOR MANUFACTURING SILICON NANOSTRUCTURES IN SINGLE CRYSTALLINE SILICON AND SILICON NANOSTRUCTURES MADE THEREBY USEFUL FOR MAKING ELECTRONIC DEVICES.

A NOVEL PROCESS FOR MANUFACTURING SILICON NANOSTRUCTURES IN SINGLE CRYSTALLINE SILICON AND SILICON NANOSTRUCTURES MADE THEREBY USEFUL FOR MAKING ELECTRONIC DEVICES.

机译:在单晶硅中制造硅纳米结构的新方法,以及由此制成的用于制造电子器件的硅纳米结构。

摘要

A novel process for manufacturing silicon nonostructures in single crystalline silicon useful for making electronic devices which comprises placing a conducting mesh mask above a single crystalline semiconductor substrate so as to extend mesh shadow on the said substrate, irradiating the said mesh mask with an ion beam of energy of at least 75 MeV to provide ion flux in the range of 5 x 108 - 5 x 109 ions.cm-2 sec-1 in the said substrate to obtain semiconductor nonostructure in single crystalline semiconductor substrate
机译:一种用于在单晶硅中制造硅非结构的新颖方法,该方法可用于制造电子设备,该方法包括在单晶半导体衬底上方放置导电网状掩模,以便在所述衬底上扩展网状阴影,并用离子束辐照所述网状掩模。至少75 MeV的能量在所述衬底中提供5 x 108-5 x 109离子.cm-2 sec-1范围内的离子通量,从而在单晶半导体衬底中获得半导体非结构

著录项

  • 公开/公告号IN231612B

    专利类型

  • 公开/公告日2009-03-27

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN326/DEL/2001

  • 发明设计人 PRASENJIT SEN;JAMIL AKHTAR;

    申请日2001-03-23

  • 分类号H01L21/265;

  • 国家 IN

  • 入库时间 2022-08-21 19:26:46

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