首页> 外国专利> ELECTROLESS PLATING PROCESS OF CROSSLINKED MONODISPERSE POLYMER PARTICLES WITH A DIAMETER OF MICRON AND THE PLATED PARTICLES THEREFROM

ELECTROLESS PLATING PROCESS OF CROSSLINKED MONODISPERSE POLYMER PARTICLES WITH A DIAMETER OF MICRON AND THE PLATED PARTICLES THEREFROM

机译:直径为MIC的交联单分散聚合物颗粒的无电电镀工艺及其再电镀

摘要

Disclosed herein are a method for the electroless metal plating of micron-sized monodisperse crosslinked polymer particles and plated particles prepared thereby. The method is performed using a dropping method, in which a plating solution, divided into a metal salt solution and a reducing salt solution, is continuously added to a plating bath. In the method for electroless metal plating of monodisperse crosslinked polymer particles, plating uniformity, plating reproducibility and dispersion properties are improved by adjusting the pH in the initial stage of the plating reaction, improving a plating solution addition method, adding an intermission, and selecting a suitable stirring method.
机译:本文公开了用于微米尺寸的单分散交联聚合物颗粒和由此制备的镀覆颗粒的化学镀金属的方法。该方法使用滴加法进行,其中将分为金属盐溶液和还原盐溶液的镀液连续添加到镀浴中。在单分散交联聚合物颗粒的化学镀金属方法中,通过在电镀反应的初始阶段调节pH值,改进电镀液添加方法,增加间歇性并选择一种合适的搅拌方法。

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