首页> 外国专利> ELECTROLESS PLATING PROCESS OF CROSSLINKED MONODISPERSE POLYMER PARTICLES WITH A DIAMETER OF MICRON AND THE PLATED PARTICLES THEREFROM

ELECTROLESS PLATING PROCESS OF CROSSLINKED MONODISPERSE POLYMER PARTICLES WITH A DIAMETER OF MICRON AND THE PLATED PARTICLES THEREFROM

机译:直径为MIC的交联单分散聚合物颗粒的无电电镀工艺及其再电镀

摘要

The electroless plating method of a monodisperse cross-linked polymer particle with a micron size and the powder of its plating are arranged to improve electroplating evenness and reproducibility are electroplated by updating an electroplate liquid into method or by the controlling pH of initial plating time. One electroless plating method of the monodisperse cross-linked polymer particle with a micron size includes the step that a thin pulp is obtained by executing catalyst operation, uses stannic chloride and palladium chloride by using a cross-linked polymer particle; It is inserted into the step that thin pulp enters an electroplating bath, the controlling pH of thin pulp enters a metal salt solution and a reducing agent solution by dividing electroplate liquid and enters thin pulp by dropping method insertion electroplate liquid than the pH high in 1~3 degree of normal plating conditions; The step for executing the electroplating operations of the entire plating time for 1/100~1/5%, by keeping a kind of color of its thin pulp of the pH of a period of time to be changed dark point; The step for continuing through the electroplating reaction of dropping method insertion electroplate liquid, in control after the pH of the thin pulp of the pH of normal plating conditions.
机译:通过将电镀液更新为方法或通过控制初始电镀时间的pH,对具有微米尺寸的单分散交联聚合物颗粒的化学镀方法及其镀覆粉末进行布置以提高电镀均匀性和再现性。一种微米尺寸的单分散交联聚合物颗粒的化学镀方法包括以下步骤:通过进行催化剂操作获得稀浆,通过使用交联聚合物颗粒使用氯化锡和氯化钯;将稀浆插入电镀液的步骤中,将稀浆的控制pH值通过分割电镀液而进入金属盐溶液和还原剂溶液中,通过滴入法将pH高于1的pH值高的插入液注入稀浆中。正常电镀条件的〜3度;通过将其稀浆的一种颜色保持一段时间的pH值改变为暗点,以使整个电镀时间的电镀操作进行1 / 100〜1 / 5%的步骤;通过滴加法的电镀反应连续进行电镀反应的步骤,在控制薄浆的pH后,将电镀液的pH值控制在正常电镀条件下。

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