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BUMPED CONTACTS FOR METAL-TO-SEMICONDUCTOR CONNECTIONS, AND METHODS FOR FABRICATING SAME
BUMPED CONTACTS FOR METAL-TO-SEMICONDUCTOR CONNECTIONS, AND METHODS FOR FABRICATING SAME
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机译:用于金属至半导电体连接的凸形接触件及其制造方法
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摘要
An improved electrical connection between a metal surface and a semiconductor surface is provided by the deposition of a conductive dimple on the metal surface, whereby the conductive dimple is interposed between the metal surface and the semiconductor substrate. For example, a conductive trace deposited on an insulating substrate may have a conductive dimple formed thereon. A semiconductor substrate, such as a silicon substrate, may be bonded to the insulating substrate over at least a portion of the metal trace having the dimple thereon to form an electrical connection between the semiconductor substrate and the conductive trace.
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