METHODS FOR FABRICATING SUB-RESOLUTION ALIGNMENT MARKS ON SEMICONDUCTOR STRUCTURES AND SEMICONDUCTOR STRUCTURES INCLUDING SAME

摘要

A method of fabricating semiconductor structures comprising sub-resolution alignment marks is disclosed. The method comprises forming a dielectric material on a substrate and forming at least one sub-resolution alignment mark extending partially into the dielectric material. At least one opening is formed in the dielectric material. Semiconductor structures comprising the sub-resolution alignment marks are also disclosed.