首页> 外国专利> METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS

METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS

机译:生产具有改善的平整度的无接点芯片卡或无接点/无触点混合芯片卡的方法

摘要

The invention relates to a method of producing a chip card comprising an antenna support, two card bodies and an electronic module or a chip which is connected to the antenna. The inventive method comprises: a first lamination step consisting in soldering two thermoplastic sheets (32, 34 or 62, 64) to each side of the antenna support (10 or 40) at a temperature that makes the material used for said sheets soften and flow completely, such that any differences in the thickness of the antenna support disappear; and a second lamination step which is performed after the time required for the thermoplastic sheets (32, 34 or 62, 64) to solidify, said second step consisting in hot press soldering two plastic layers (36, 38 or 66, 68) forming the card bodies to the flat plastic-coated faces of the uniform-thickness, plastic-coated antenna support (30 or 60).
机译:芯片卡的制造方法技术领域本发明涉及一种芯片卡的制造方法,该芯片卡包括天线支架,两个卡体和与天线连接的电子模块或芯片。本发明的方法包括:第一层压步骤,该步骤包括在使用于所述片的材料软化并流动的温度下将两个热塑性片(32、34或62、64)焊接到天线支架(10或40)的每一侧。完全消除天线支架厚度的任何差异;第二层压步骤是在热塑性片材(32、34或62、64)固化所需的时间之后执行的,所述第二步骤包括热压焊接两个塑料层(36、38或66、68)以形成热塑性塑料。卡体到厚度均匀的塑料涂层天线支架(30或60)的平坦塑料涂层表面。

著录项

  • 公开/公告号EP1442424B1

    专利类型

  • 公开/公告日2009-02-25

    原文格式PDF

  • 申请/专利权人 ASK S.A.;

    申请/专利号EP20030795045

  • 申请日2003-09-12

  • 分类号G06K19/077;

  • 国家 EP

  • 入库时间 2022-08-21 19:18:52

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