首页>
外国专利>
METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS
METHOD OF PRODUCING A CONTACTLESS CHIP CARD OR A CONTACT/CONTACTLESS HYBRID CHIP CARD WITH IMPROVED FLATNESS
展开▼
机译:生产具有改善的平整度的无接点芯片卡或无接点/无触点混合芯片卡的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a method of producing a chip card comprising an antenna support, two card bodies and an electronic module or a chip which is connected to the antenna. The inventive method comprises: a first lamination step consisting in soldering two thermoplastic sheets (32, 34 or 62, 64) to each side of the antenna support (10 or 40) at a temperature that makes the material used for said sheets soften and flow completely, such that any differences in the thickness of the antenna support disappear; and a second lamination step which is performed after the time required for the thermoplastic sheets (32, 34 or 62, 64) to solidify, said second step consisting in hot press soldering two plastic layers (36, 38 or 66, 68) forming the card bodies to the flat plastic-coated faces of the uniform-thickness, plastic-coated antenna support (30 or 60).
展开▼