Study of chip durability structure of contactless IC cards

摘要

This paper reports the chip durability structure of the contactless IC card based on the relation between Si chip and reinforcing plate. The durability test which used the Si chip was performed and it is found that enlarging the Si area and thinning the Si layer are effective for keeping the durability of the Si chip. Next, the thickness of the Si chip is fixed at 50 μm and some kinds of reinforcing plate are used for the durability test, and it is clarified that the SUS plate of 100 μm is the best as the reinforcing structure. Moreover, to secure durability in consideration of the process simplification and the cost, it is shown that the structure to cover the carbon reinforcing plate of 100 μm thickness with molding is effective. It is important that the reinforcing plate of the Si chip has hardness equal with the Si chip, and the chip arrangement avoids the influence of the bend stress and the twist stress.