首页> 外国专利> Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

机译:具有改善的平坦度的非接触式芯片卡或接触/非接触式混合芯片卡的制造方法

摘要

In a first stage two leaves of homogeneous thermoplastic are welded to either side of a support (30) of an antenna (32,34) and integrated circuit (40). The temperature and pressure applied cause the leaves to flow and eliminate all differences of thickness of the components. After solidification two layers of plastic material (62,64) are applied to the antenna sandwich (50) to form the body of the card
机译:在第一阶段,将两片均质热塑性塑料的叶片焊接到天线(32,34)和集成电路(40)的支架(30)的任一侧。施加的温度和压力使叶片流动并消除了部件厚度的所有差异。固化后,将两层塑料材料(62,64)涂到天线夹层(50)上,形成卡的主体

著录项

  • 公开/公告号AU2003276333B2

    专利类型

  • 公开/公告日2010-01-21

    原文格式PDF

  • 申请/专利权人 ASK S.A.;

    申请/专利号AU20030276333

  • 申请日2003-09-12

  • 分类号B42D15/10;B32B37;B32B37/02;B32B37/20;G06K19/07;G06K19/077;

  • 国家 AU

  • 入库时间 2022-08-21 18:42:02

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