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Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
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机译:具有改善的平坦度的非接触式芯片卡或接触/非接触式混合芯片卡的制造方法
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摘要
In a first stage two leaves of homogeneous thermoplastic are welded to either side of a support (30) of an antenna (32,34) and integrated circuit (40). The temperature and pressure applied cause the leaves to flow and eliminate all differences of thickness of the components. After solidification two layers of plastic material (62,64) are applied to the antenna sandwich (50) to form the body of the card
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