PLASMA DAMAGE FREE SPUTTER GUN, SPUTTER, PLASMA PROCESS APPARATUS AND FILM-FORMING METHOD

摘要

Provided are a plasma-damage-free sputter gun, which is capable of forming a layer at high speed, a sputter apparatus including the sputter gun, a plasma processing apparatus using the sputter gun, and a method of forming a layer using the sputter gun. The sputter gun includes: a yoke plate having a single-sided or double-sided opening; and a plurality of magnets disposed on the yoke plate at regular intervals. Each of the magnets includes upper and lower portions that are integrally formed and have different magnetic poles, and the magnets are arranged in a line. Accordingly, it is possible to form a layer at high speed without causing plasma damage using the above-described gun, apparatuses, and method.