Method of connecting a semiconductor chip on an interconnection carrier

摘要

the invention relates to a method for the electrical connection of a chip (10) with a support semiconductor chip interconnection (20), consisting of areas of contact (12), a support (20) includes an interconnection substrate (21) and (22) for receiving slots.according to the invention, the method includes a step of growing a first layer of metal (50) on the beaches of contact (12) of the chip, and a step of growing a second metal layer (51) on the beaches of receipt (22) of the interconnection medium, high deposit ctrolytique metal.until the first and the second metal layer are formed between the contact and the electric contact of the chip and beaches beaches receiving the interconnection medium. application to the realization of the electronic cards and electronic modules.