A method for connecting a semiconductor chips with a chip carrier and arrangement with a semiconductor chip and a chip carrier

摘要

A method for connecting a semiconductor chip (1), which a first connecting surface (1a), with a chip carrier (2), of a second connecting surface (2a), said method comprises the following process steps:– Providing the chip carrier (2) with a in the second connecting surface (2a) formed concavely shaped section (2b), the at least in a lateral direction is concavely curved,– Application of a connecting means (3) to the first connecting surface (1a) of the semiconductor chip (1) and / or the concavely shaped section (2b) of the second connecting surface,– Positioning of the semiconductor chip (1) in such a way that the semiconductor chip (1) in the lateral direction, completely within the concave portion (2b) are arranged, and that the first connecting surface (1a) and the concavely shaped portion (2b) of the second connecting surface (2a) are located opposite one another,– Pressing of the semiconductor chip (1) on the chip carrier (2) in such a way that the semiconductor chip (1) is bent and that through the connecting means (3), a form-fitting connection between the first..