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LEAD-FREE SOFT SOLDER HAVING IMPROVED PROPERTIES AT ELEVATED TEMPERATURES
LEAD-FREE SOFT SOLDER HAVING IMPROVED PROPERTIES AT ELEVATED TEMPERATURES
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机译:无铅软焊料在高温下的性能得到改善
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摘要
Lead-free solders based on an SnInAg solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium.
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