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FORMATION OF OHMIC CONTACTS IN III-NITRIDE LIGHT EMITTING DEVICES

机译:III型氮化物发光器件中的欧姆接触的形成

摘要

A III-nitride light emitting diode and a manufacturing method thereof are provided to form the Ohmic contact by optimizing the P-type layer of the light emitting device. The n-type layer(16) of the III-nitride is formed on a substrate(14). An active area(18) is formed on the n-type layer. The p-type AlxGa(1-x)N(0=x=1) layer(20) is formed on the active area. The p-type transition layer(24) is formed on the p-type AlxGa (1-x)N layer and comprises super lattice. The super lattice comprises the first sub layer of the doped p-type material, and the second sub layer which has the dopant concentration lower than the dopant concentration of the first sub layer. The light emitting diode comprises the n-type contact unit connected to the n-type layer, and the p-type contact unit connected to the p-type transition layer.
机译:提供一种III族氮化物发光二极管及其制造方法,以通过优化发光器件的P型层来形成欧姆接触。 III族氮化物的n型层(16)形成在基板(14)上。在n型层上形成有源区(18)。在有源区上形成p型AlxGa(1-x)N(0 <= x <= 1)层(20)。 p型过渡层(24)形成在p型AlxGa(1-x)N层上并且包括超晶格。超级晶格包括掺杂的p型材料的第一子层和具有低于第一子层的掺杂剂浓度的掺杂剂浓度的第二子层。发光二极管包括连接至n型层的n型接触单元和连接至p型过渡层的p型接触单元。

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