VERTICAL MEMS PROBE, VERTICAL MEMS PROBE CARD, AND METHOD OF MANUFACTURING THE SAME

摘要

A vertical MEMS probe, a vertical MEMS probe card, and a manufacturing method thereof are provided to receive an electric signal regardless of irregular arrangement of the pad of the semiconductor device and the integrity of the semiconductor device by including a sufficient restoring force by a concave-convex part and a beam bending part for physical stress. A vertical MEMS probe(100) includes a contact unit, a beam bending part(120) and a connection unit(130). The contact unit is formed by depositing a conductive material on a tip mold part equipped in a silicon substrate member. The contact unit includes a tip(112) contacting the contact terminal of the object like the semiconductor device. The beam bending part is formed by depositing or plating the conductive material in the beam bending mold part. The connection unit is connected to the beam bending part and is fixed in the probe support stand. The connection unit buffers the physical stress applied to the beam bending part. The connection unit has a concavo-convex part with the restoring force.