METHOD FOR PREVENTING KIRKENDALL VOID FORMATION FOR PACKAGES FABRICATED BY JOINING AN ELECTRONIC COMPONENT FINISHED WITH ELECTROPLATED CU TO SOLDER AND ELECTRONIC PACKAGES FABRICATED BY USING THE SAME

摘要

The invention discloses a kind of methods, it include that Pb ingredients inhibit Kirkendall gap for being welded from the interface being created in Cu3 Sn intermetallic compounds or between copper and Cu3 Sn by increasing oxide morphology element, for the bonding electronic components to solder and the free solders of Pb, to improve reliability of the manufacture by identical electronic package. The method of the present invention can effectively inhibit the formation in Kirkendall gap, continually be generated from the solder joints of electronic package, so that the electricity of packet is improved, mechanical and/or thermal reliability.