Method for preventing Kirkendall void formation for packages fabricated by joining an electronic component finished with electroplated Cu containing sulfur to solder and electronic packages fabricated by using the same

摘要

Disclosed is a method for inhibiting Kirkendall voids from being generated inside Cu3 Sn in-termetallic compound or at interface between Cu and Cu3 Sn by adding sulfide forming elements to solder containing Pb ingredient used for bonding electronic components to the solder as well as Pb free solder, so as to improve reliability of electronic packages fabricated by the same. The present inventive method can efficiently inhibit formation of Kirkendall voids, which are frequently generated at solder joints of the electronic packages, thereby improving electrical, mechanical and/or thermal reliability of the packages.