首页> 外国专利> FABRICATION METHOD OF AN IMMUNOSENSOR CHIP USING GOLD NANO-PARTICLES AND FUSION PROTEINS WITH A PORTION OF HIGH AFFINITY GOLD BINDING PROTEINS AND PROTEIN A OR G AND THEIR APPLICATIONS FOR DETECTION OF BIOMOLECULES

FABRICATION METHOD OF AN IMMUNOSENSOR CHIP USING GOLD NANO-PARTICLES AND FUSION PROTEINS WITH A PORTION OF HIGH AFFINITY GOLD BINDING PROTEINS AND PROTEIN A OR G AND THEIR APPLICATIONS FOR DETECTION OF BIOMOLECULES

机译:使用部分高亲和力金结合蛋白和蛋白A或G的金纳米粒子和融合蛋白制备免疫芯片的方法及其在生物分子检测中的应用

摘要

A sensor chip using the technique of surface Plasmon resonance (SPR) is provided to introduce a nano gold colloid without a probe, improve productivity and economic efficiency and increase the sensitivity of chip detection. A sensor chip using a surface plasmon resonance (SPR) comprises: a intermediate layer which is formed by introducing organic single molecule having a functional group of amine(-NH2) or thiol(-SH) functional group at the one side end and thiol(-SH) functional group at the other side end on substrate in which gold is applied or dotted; a gold colloid layer which is absorbed on the intermediated layer; a fusion protein in which a gold binding protein (GBP) and protein A or G is bonded to the gold colloid layer; and an antibody which is bonded to the fixed fusion protein.
机译:提供了一种使用表面等离子共振(SPR)技术的传感器芯片,以引入无探针的纳米金胶体,提高了生产率和经济效率,并提高了芯片检测的灵敏度。使用表面等离子体激元共振(SPR)的传感器芯片包括:中间层,该中间层是通过引入在一侧端具有胺(-NH2)或硫醇(-SH)官能团的有机单分子和硫醇( -SH)在基材上另一侧末端的官能团,该基材上已涂有金或点有金;被吸收在中间层上的金胶体层;融合蛋白,其中金结合蛋白(GBP)和蛋白A或G结合到金胶体层上;与固定的融合蛋白结合的抗体。

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