COMPOSITION FOR FORMING A POLISHING LAYER OF A CHEMICAL MECHANICAL POLISHING PAD, CHEMICAL MECHANICAL POLISHING PAD, AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

A composition for forming a polishing layer of a chemically mechanically polishing pad, and a CMP method using it are provided to improve the smoothness of the polished product and to reduce scratch. A composition for forming a polishing layer of a chemically mechanically polishing pad comprises a polyurethane having a carbon-carbon double bond at the side chain, and a crosslinking agent. The polyurethane has at least one functional group selected from a vinyl group and an allyl group. The polyurethane has a conjugated diene-based (co)polymeric backbone.