IMAGE SENSOR MODULE AND IMAGE SENSOR MODULE ASSEMBLY CAPABLE OF WAFER LEVEL-CHIP SCALE PACKAGE AND FABRICATING METHOD THEREOF TO MINIMIZE THE THICKNESS OF THE ASSEMBLED PACKAGE

摘要

PURPOSE: An image sensor module and image sensor module assembly capable of wafer level-chip scale package and fabricating method thereof are provided to reduce process time by using the pick-and-flip-and-place operation.;CONSTITUTION: The image sensor module(100) includes the glass substrate(110), the semiconductor device(210) for the image sensing, the wirings(132), the solder bumps(142), and the dam(172) for the sealing. The image detection area(220) is formed in the surface of central part of the semiconductor device for the image sensing. The bump pads(215) are arranged to the peripheral unit of the semiconductor device for the image sensing. The solder bump is formed in the location corresponding to the bump pads. The dam for the sealing surrounds the outer side of the image detection region between the glass substrate and the semiconductor device.;COPYRIGHT KIPO 2010