IMAGE SENSING DEVICES INCLUDING IMAGE SENSOR CHIPS, IMAGE SENSOR PACKAGE MODULES EMPLOYING THE IMAGE SENSING DEVICES, ELECTRONIC PRODUCTS EMPLOYING THE IMAGE SENSOR PACKAGE MODULES, AND METHODS OF FABRICATING THE SAME

摘要

An image sensor package includes an image sensor chip, a handling substrate mounted on a front side of the image sensor chip and a through electrode disposed on a backside of the image sensor chip. The through electrode extends into the image sensor chip. Moreover, the image sensor chip includes a semiconductor substrate having a pixel region and a peripheral circuit region, a photoelectric transformation section disposed in the semiconductor substrate of the pixel region and a dielectric layer disposed on a front surface of the semiconductor substrate. The dielectric layer has a step region so that a top surface of the dielectric layer in the pixel region is lower than that of the dielectric layer in the peripheral circuit region. The image sensor chip further includes a conductive pad disposed on the dielectric layer in the peripheral circuit region and is electrically connected to the through electrode.