METHOD FOR CONTACTING ELECTRICAL CONTACT SURFACES OF A SUBSTRATE AND DEVICE CONSISTING OF A SUBSTRATE HAVING ELECTRICAL CONTACT SURFACES

摘要

The present invention relates to a method for connecting an electrical contact surface (21, 112) on the surface 20 of the substrate 1. According to this method, the film (3) based on polyimide or epoxy is completely covering the surface including the contact surface in the vacuum is deposited onto the surface in a way that is adhered to the surface. Due to the individual film opening window 31 do not contact each side is overwritten to be connected on the surface, a contact is formed in a plane that is not between each cover contact surface and the metal layer (4). The process according to the invention is used to form a large area of ​​contact for the power semiconductor chip, enabling the high current density.