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METHOD FOR CONTACTING ELECTRICAL CONTACT SURFACES OF A SUBSTRATE AND DEVICE CONSISTING OF A SUBSTRATE HAVING ELECTRICAL CONTACT SURFACES
METHOD FOR CONTACTING ELECTRICAL CONTACT SURFACES OF A SUBSTRATE AND DEVICE CONSISTING OF A SUBSTRATE HAVING ELECTRICAL CONTACT SURFACES
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机译:接触基材的电接触面的方法以及具有接触面的基材的设备
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摘要
A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
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