An FBGA(Fine line Ball Grid Array) package is provided to reduce the loss of process time required for attaching a semiconductor chip on a printed circuit board by forming a pattern with a preset shape on the printed circuit board. A printed circuit board(216) has a cavity(200) at the center thereof and a circuit wiring including a bond finger(222) and a ball land. A semiconductor chip is attached on an upper surface of the printed circuit board in a face-down type. Bonding pads(218) are arranged on the center of the semiconductor chip. A metal wire electrically connects the bonding pad of the semiconductor chip to the bond finger by passing through the cavity. An encapsulant encapsulates the upper surface of the printed circuit board including the semiconductor chip and the cavity of the printed circuit board including the metal wire. A solder ball is attached to the ball land on a lower surface of the printed circuit board. The printed circuit board is provided with a plating line for forming the circuit wiring on the arrangement of the bonding pads and the outermost bond finger with a step.
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