A method to the adjusted frequency of electronic components, comprising the steps of:– Providing a housing substrate (2; 20) is made of a semiconductor material,– The formation of a plurality of cavities (6) in the package substrate (2; 20),– Equipping of the cavities (6) with the electronic components (8),– Closing of the cavities (6) with a cap substrate or a surface layer (4), and– Separation of the packed in components (8).
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