Device for replacement of electronic components from film, particularly from un-packed semiconductor chips of cohesive mounting film, has base element, where multiple recesses are formed at front side of base element

摘要

The replacement device (100) has a base element (110), where multiple recesses (116) are formed for retaining pins (121,122,123,124,151). The recesses are formed at a front side (115a) of the base element, and are distributed in a specific grid. A clamping device is embodied such that each of the two pins, brought into every recess, is fixed at a same time. An independent claim is included for a method for replacement of electronic components from a film, particularly for replacement from un-packed semiconductor chips of a cohesive mounting film.