首页> 外国专利> Vapor deposition device, an apparatus for controlling of the vapor deposition device, method for controlling the vapor deposition device and method for the use of the vapor deposition device

Vapor deposition device, an apparatus for controlling of the vapor deposition device, method for controlling the vapor deposition device and method for the use of the vapor deposition device

机译:气相沉积设备,用于控制气相沉积设备的设备,用于控制气相沉积设备的方法以及使用该气相沉积设备的方法

摘要

Vapor deposition device for performing a film formation on a target object by vapour deposition, wherein the device comprises:a vapor deposition source for the vaporization of a film-forming, which is a starting material for the film formation is;a blowing mechanism which, with the vapor deposition source is connected by a connecting path, for blowing out of the film-forming, the of the vapor deposition source is evaporated;a first process chamber, the mechanism therein, the blast pipe, for carrying out of the film formation on the target object therein with the film forming material selected, the mechanism is blown out from the blast pipe;a second process chamber, the separated from the first process chamber is installed, for receiving the vapor deposition source therein; andan outlet valve mechanism, which is connected with the first process chamber, to evacuate the interior of the first process chamber to a predetermined vacuum level.
机译:用于通过气相沉积在目标物体上进行成膜的气相沉积装置,其中该装置包括:用于成膜的汽化的气相沉积源,其是成膜的起始材料;吹气机构,与蒸镀源通过连接路径相连,用于吹出成膜,蒸镀源的蒸发;第一处理腔室,其中的机构,鼓风管,用于进行成膜。在选择了成膜材料的目标物体上,从鼓风管吹出机构;第二处理室,与第一处理室隔开,用于在其中容纳气相沉积源。与第一处理腔室相连的出口阀机构,用于将第一处理腔室的内部抽空到预定的真空度。

著录项

  • 公开/公告号DE112007002293T5

    专利类型

  • 公开/公告日2009-11-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20071102293T

  • 发明设计人

    申请日2007-09-25

  • 分类号C23C14/24;H01L51/50;H05B33/10;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:21

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