THERMOSETTING SOLDER RESIST COMPOSITION, FILM FOR FORMING SOLDER RESIST, METHOD FOR FORMING SOLDER RESIST, AND CIRCUIT BOARD

摘要

PPROBLEM TO BE SOLVED: To provide a solder resist applicable to a circuit board with a narrow pitch, satisfying various physical properties such as high insulating properties and good electric characteristics (a low dielectric constant, a low dielectric loss). PSOLUTION: The solder resist composition contains a polybenzoxazine resin with weight-average molecular weight of 1,000 or more. The thermosetting solder resist composition comprises 100 pts.wt. of the polybenzoxazine resin and 3-100 pts.wt. of an epoxy resin. PCOPYRIGHT: (C)2010,JPO&INPIT