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MICRO ELECTRIC MECHANICAL SYSTEM DEVICE AND MANUFACTURING METHOD FOR THE SAME

机译:微型机电系统装置及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a MEMS device which has a small parasitic capacitance applied to a MEMS element through a semiconductor substrate and is superior in reliability.;SOLUTION: The MEMS device comprises a semiconductor substrate 1 such as a silicon substrate, an insulation coating layer 2 formed in the shape of an island on the semiconductor substrate 1, an inorganic insulating film 3 formed on an entire surface of the semiconductor substrate 1 to cover the island-shaped insulation coating layer 2, a pattern of a wiring layer 4 formed on the inorganic insulating film 3 in an island-shaped region where the insulation coating layer 2 is formed, and the MEMS element 5 formed on the pattern of the wiring layer 4.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种MEMS器件,该器件具有小的寄生电容,该寄生电容通过半导体衬底施加到MEMS元件,并且可靠性优异。解决方案:MEMS器件包括诸如硅衬底的半导体衬底1,绝缘体。在半导体基板1上形成为岛状的被覆层2,在半导体基板1的整个面上形成以覆盖岛状的绝缘被覆层2的无机绝缘膜3,形成的布线层4的图案在形成绝缘涂层2的岛形区域中的无机绝缘膜3上形成MEMS元件,并在布线层4的图案上形成MEMS元件5。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2009279733A

    专利类型

  • 公开/公告日2009-12-03

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20080136618

  • 发明设计人 YAMAZAKI HIROAKI;

    申请日2008-05-26

  • 分类号B81B3/00;B81C1/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:27

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