REINFORCING FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, REINFORCING PLATE FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND LAMINATED BODY FOR FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a reinforcing film for an FPC board that is excellent in adhesion properties with a commercially-available adhesive sheet as the reinforcing film for an FPC board and prevents the occurrence of partial peeling-off or bulging on the adhesive interface even when an FPC board and a reinforcing plate are stuck to each other by using the commercially-available adhesive sheet in a solder reflow process, a reinforcing plate for an FPC board, and a laminated body for an FPC board.;SOLUTION: The reinforcing film for a flexible printed circuit board has a biaxially-oriented polyester film base-material layer. The polyester composing the base-material layer is polyethylene-naphthalate. At least one face of the base-material layer is provided with a coating layer including a polymeric binder containing an acrylic resin having an oxazoline group. The thermal shrinkage factor of the reinforcing film when subjected to heating treatment for ten minutes at 230°C is ≥-1% and 4% in both directions of the film longitudinal direction and the film width direction.;COPYRIGHT: (C)2010,JPO&INPIT