FILM FOR REINFORCING FLEXIBLE PRINTED CIRCUIT BOARD, FLEXIBLE PRINTED CIRCUIT REINFORCING PLATE COMPOSED OF THE SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD LAMINATE COMPOSED OF THE FILM AND PLATE

摘要

PPROBLEM TO BE SOLVED: To provide a film for reinforcing a flexible printed circuit board, a flexible printed circuit reinforcing plate composed of the film, and a flexible printed circuit board laminate composed of the plate which have excellent adhesive properties with a commercially available adhesive plate as the film for reinforcing the FPC board, do not cause partial exfoliation or swelling at an adhesive interface even if the FPC board is laminated with the reinforcing plate by the use of the commercially available adhesive plate in the solder reflow step, and excellent in heat dissipation property. PSOLUTION: In the film for reinforcing the flexible printed circuit board having a biaxial orientation polyester film substrate layer, the polyester constituting the substrate layer is polyethylene naphthalene dicarboxylate, at least one face of the substrate layer has a coating layer including a polymer binder including an acrylic resin having an oxazoline radical, a thermal shrinkage factor of the reinforcing film when heat treatment is performed at 230C for 10 minutes is equal to or larger than -3% and smaller than 3% in both longitudinal and width directions of the film, and thermal conductivity is 0.2-10 W/m K. PCOPYRIGHT: (C)2011,JPO&INPIT