Amendment quantitative calculation manner of the bonding device and the bonding device and the bonding head where

摘要

PROBLEM TO BE SOLVED: To correct the picking-up position and bonding position of a bonding apparatus highly accurately.;SOLUTION: A bonding head 21 which is movable in the X- and Y-directions is attached to the bonding apparatus 1, and a sliding arm 23 whereto a collet 24 is attached removably is attached movably in the Z-direction to the bonding apparatus 1 movably, and further, a target 25 having a stamped crossing-line mark 26 is attached to the end of the sliding arm 23. Also, a mark imaging camera 31 for imaging the mark 26 of the target 25 when the bonding head 21 positions in the picking-up position of the bonding apparatus 1 is attached to the bonding apparatus 1. Then, a control unit 40 calculates the picking-up-position correcting quantity of the bonding apparatus 1 based on the mark picture photographed by the mark imaging camera 31, and further, calculates the bonding-position correcting quantity of the bonding apparatus 1 based on the calculated picking-up-position correcting quantity.;COPYRIGHT: (C)2010,JPO&INPIT