CHUCK TABLE CLEANING METHOD, CHUCK TABLE CLEANING APPARATUS, AND SEMICONDUCTOR WAFER PLANAR PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a chuck table cleaning method, a chuck table cleaning apparatus, and a semiconductor wafer planar processing apparatus for easily removing silicone dust adhered to an adsorption surface of a chuck table, and thereby recovering the adsorption surface of the chuck table in a non-contaminated condition.;SOLUTION: In a cleaning method of the chuck table that removes silicone dust adhered to an adsorption surface 13 of a chuck table 8 that adsorbs a semiconductor wafer, plasma cleaning is carried out to the adsorption surface 13 of the chuck table 8 using a mixed gas including sulfur hexafluoride gas, oxygen gas, and argon gas.;COPYRIGHT: (C)2010,JPO&INPIT