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Component mounting apparatus and component mounting method and parts reversal devices and components inversion method

机译:零件安装装置及零件安装方法,零件反转装置及零件反转方法

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting a part, an apparatus and method for inverting a part for promoting the miniaturization of the apparatus by compactly composing an inverting mechanism for inverting part taken out of a part supply section.;SOLUTION: A part inverting stage 14 arranged on the part mounting apparatus for mounting a chip 6 on a substrate after inverting it up and down is arranged on a part placement block 41 in which a placement surface 41a is provided by arranging a plurality of part inverting units 45 in a configuration for inverting a holding plate 46 for holding the chip 6 by a rotating mechanism 49 in parallel. The plurality of chips 6 placed on the holding plate 46 are inverted by a transfer head 33 and are placed on the placement surface 41a, and the chips 6 are taken out by the transfer head 33 and are mounted on the substrate, thus an inverting mechanism for inverting the parts taken out of the part supply section is composed compactly and the miniaturization of the apparatus is promoted.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种用于安装零件的设备和方法,一种用于使零件倒置的设备和方法,以通过紧凑地构成用于反转从零件供应部取出的零件的倒置机构来促进设备的小型化。 :在零件放置装置41上设置有零件翻转台14,零件翻转台14布置在零件安装装置上,用于在将晶片6上下翻转之后将芯片6安装在基板上,在零件放置块41中,通过布置多个零件翻转单元来提供放置表面41a。在图45中,通过平行地通过旋转机构49使用于保持芯片6的保持板46反转的结构。放置在保持板46上的多个芯片6被传送头33翻转并放置在放置表面41a上,并且芯片6被传送头33取出并安装在基板上,因此翻转机构使从零件供应部分取出的零件翻转的结构紧凑,并促进了设备的小型化。;版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP4466377B2

    专利类型

  • 公开/公告日2010-05-26

    原文格式PDF

  • 申请/专利权人 パナソニック株式会社;

    申请/专利号JP20050002204

  • 发明设计人 笹栗 真二;

    申请日2005-01-07

  • 分类号H01L21/60;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 19:00:06

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