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Low dielectric loss tangent resin composition, curable film, cured product, electrical component using the same, and production method thereof
Low dielectric loss tangent resin composition, curable film, cured product, electrical component using the same, and production method thereof
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机译:低介电损耗正切树脂组合物,可固化膜,固化产物,使用该组合物的电气部件及其制造方法
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摘要
According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, RSUP1 /SUPis hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.
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